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• Microsize Packages: SC70-3, SOT-23-3, UQFN-8
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• Low Supply Current: 3.9 μA (typ)
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• Extremely Low Dropout Voltage: 110 mV (typ)
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• High Output Current: ±5 mA
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• Low Temperature Drift: 30 ppm/°C (max)
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• High Initial Accuracy: ±0.15% (max)
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• 0.1-Hz to 10-Hz Noise: 35 μVPP (REF3312)
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• Voltage Options: 1.2 V, 1.8 V, 2.5 V, 3 V, 3.3 V
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| CATALOG |
REF3318AIDBZR COUNTRY OF ORIGIN
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REF3318AIDBZR PARAMETRIC INFO
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REF3318AIDBZR PACKAGE INFO
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REF3318AIDBZR MANUFACTURING INFO
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REF3318AIDBZR PACKAGING INFO
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REF3318AIDBZR ECAD MODELS
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REF3318AIDBZR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Thailand
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Malaysia
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Philippines
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PARAMETRIC INFO
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| Topology |
Series |
| Reference Type |
Precision |
| Output Voltage (V) |
1.8 |
| Initial Accuracy |
0.15% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
50ppm/mA |
| Line Regulation |
50ppm/V |
| Maximum Input Voltage (V) |
7.5 |
| Maximum Output Current (mA) |
5 |
| Maximum Temperature Coefficient |
30ppm/°C |
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PACKAGE INFO
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| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.04(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
0.95 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.04(Max) |
| Package Overall Width (mm) |
2.64(Max) |
| Package Overall Height (mm) |
1.12(Max) |
| Seated Plane Height (mm) |
1.12(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.05 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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| APPLICATIONS |
| • Portable Equipment |
| • Tablets and Smartphones |
| • Hard Disk Drives |
| • Sensor Modules |
| • Data Acquisition Systems |
| • Medical Equipment |
| • Test Equipment |
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