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• Microsize Packages: SC70-3, SOT-23-3, UQFN-8
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• Low Supply Current: 3.9 μA (typ)
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• Extremely Low Dropout Voltage: 110 mV (typ)
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| • High Output Current: ±5 mA
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| • Low Temperature Drift: 30 ppm/°C (max) |
| • High Initial Accuracy: ±0.15% (max) |
| • 0.1-Hz to 10-Hz Noise: 35 μVPP (REF3312) |
| • Voltage Options: 1.2 V, 1.8 V, 2.5 V, 3 V, 3.3 V |
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| CATALOG |
| REF3325AIDBZR COUNTRY OF ORIGIN |
REF3325AIDBZR PARAMETRIC INFO
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REF3325AIDBZR PACKAGE INFO
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REF3325AIDBZR MANUFACTURING INFO
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REF3325AIDBZR PACKAGING INFO
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REF3325AIDBZR EACD MODELS
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| REF3325AIDBZR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Philippines |
| China |
| Thailand |
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PARAMETRIC INFO
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| Topology |
Series |
| Reference Type |
Precision |
| Output Voltage (V) |
2.5 |
| Initial Accuracy |
0.15% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
50ppm/mA |
| Line Regulation |
50ppm/V |
| Maximum Input Voltage (V) |
7.5 |
| Maximum Output Current (mA) |
5 |
| Maximum Temperature Coefficient |
30ppm/°C |
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PACKAGE INFO
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| Supplier packaging |
SOT-23 |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
3 |
| Pin shape |
Gull-wing |
| PCB |
3 |
| ears |
N/R |
| Pin spacing (mm) |
0.95 |
| Package length (mm) |
3.04(Max) |
| Package width (mm) |
1.4(Max) |
| Package height (mm) |
0.95 |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.04(Max) |
| Package Overall Width (mm) |
2.64(Max) |
| Package Overall Height (mm) |
1.12(Max) |
| Mounting surface height (mm) |
1.12(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Small Outline Transistor |
| Package series name |
SOT |
| JEDEC |
TO-236AB |
| Package outline |
Link to datasheet |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| Reel Diameter (in) |
7.05 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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APPLICATIONS
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• Portable Equipment
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| • Tablets and Smartphones |
| • Hard Disk Drives |
| • Sensor Modules |
| • Data Acquisition Systems |
| • Medical Equipment |
| • Test Equipment |
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