 |
|
• Low temperature drift:
– High-grade: 3 ppm/°C (maximum)
– Standard-grade: 8 ppm/°C (maximum) |
• High accuracy:
– High-grade: 0.05% (maximum)
– Standard-grade: 0.1% (maximum) |
| • Low noise: 3 μVPP/V |
• Excellent long-term stability:
– 22 ppm after first 1000 hours (SOIC-8)
– 50 ppm after first 1000 hours (VSSOP-8) |
| • High-output current: ±10 mA |
| • Temperature range: –40°C to 125°C |
| |
| CATALOG |
| REF5025AIDGKR COUNTRY OF ORIGIN |
| REF5025AIDGKR PARAMETRIC INFO |
| REF5025AIDGKR PACKAGE INFO |
| REF5025AIDGKR MANUFACTURING INFO |
| REF5025AIDGKR PACKAGING INFO |
| REF5025AIDGKR ECAD MODELS |
| REF5025AIDGKR FUNCTIONAL BLOCK DIAGRAM
|
| REF5025AIDGKR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Thailand |
|
| PARAMETRIC INFO |
| Topology |
Series |
| Reference Type |
Precision |
| Output Voltage (V) |
2.5 |
| Initial Accuracy |
0.1% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
30ppm/mA |
| Line Regulation |
1ppm/V |
| Maximum Input Voltage (V) |
18 |
| Regulation Condition Change In Load |
20mA |
| Maximum Output Current (mA) |
10 |
| Maximum Temperature Coefficient |
8ppm/°C |
|
| PACKAGE INFO |
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| ECAD Models |
 |
|
| FUNCTIONAL BLOCK DIAGRAM
|
 |
|
| APPLICATIONS |
| • Precision data acquisition systems |
| • Semiconductor test equipment |
| • Industrial process controls
|
| • Medical instrumentation
|
| • Pressure and temperature transmitters |
| • Lab and field instrumentation |
|
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