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• Low temperature drift (maximum):– Enhanced-grade (New): 2.5ppm/°C– High-grade: 3ppm/°C– Standard-grade: 8ppm/°C
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• High accuracy (maximum):– Enhanced-grade: 0.025%– High-grade: 0.05%– Standard-grade: 0.1%
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• Low noise:– Enhanced-grade: 0.5μVPP/V– High/Standard-grade: 3μVPP/V
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• Excellent long-term stability:– 22ppm after first 1000 hours (SOIC-8)– 50ppm after first 1000 hours (VSSOP-8)
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• Wide input voltage support:– Enhanced-grade: 42V– High/Standard-grade: 18V
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• High-output current: ±10mA
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• Temperature range: -40°C to 125°C
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| CATALOG |
REF5050AIDGKR COUNTRY OF ORIGIN
|
REF5050AIDGKR PARAMETRIC INFO
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REF5050AIDGKR PACKAGE INFO
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REF5050AIDGKR MANUFACTURING INFO
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REF5050AIDGKR PACKAGING INFO
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REF5050AIDGKR ECAD MODELS
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REF5050AIDGKR APPLICATIONS
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COUNTRY OF ORIGIN
|
China
|
Thailand
|
Malaysia
|
|
PARAMETRIC INFO
|
| Topology |
Series |
| Reference Type |
Precision |
| Output Voltage (V) |
5 |
| Initial Accuracy |
0.1% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Typical Output Noise Voltage |
3uV(p-p) |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
30ppm/mA |
| Line Regulation |
1ppm/V |
| Maximum Input Voltage (V) |
18 |
| Regulation Condition Change In Load |
20mA |
| Maximum Output Current (mA) |
10 |
| Maximum Temperature Coefficient |
8ppm/°C |
|
|
PACKAGE INFO
|
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
0.95 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
3.1 |
| Minimum PACKAGE_DIMENSION_L |
2.9 |
| Maximum PACKAGE_DIMENSION_W |
3.1 |
| Minimum PACKAGE_DIMENSION_W |
2.9 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
|
• Precision data acquisition systems
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• Semiconductor test equipment
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• Industrial process controls
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• Medical instrumentation
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• Pressure and temperature transmitters
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• Lab and field instrumentation
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