RV1C001ZPT2L ROHM Semiconductor MOSFET P-CH 20V 0.1A VML0806

label:
2024/09/10 168
RV1C001ZPT2L ROHM Semiconductor MOSFET P-CH 20V 0.1A VML0806


CATALOG
RV1C001ZPT2L PARAMETRIC INFO
RV1C001ZPT2L PACKAGE INFO
RV1C001ZPT2L MANUFACTURING INFO
RV1C001ZPT2L PACKAGING INFO
RV1C001ZPT2L ECAD MODLES


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 20
Maximum Absolute Continuous Drain Current (A) 0.1
Maximum Continuous Drain Current (A) 0.1
Maximum Gate Source Voltage (V) ±10
Maximum Drain Source Resistance (mOhm) 3800@4.5V
Maximum Power Dissipation (mW) 100
Category Small Signal
Typical Input Capacitance @ Vds (pF) 15@10V
Typical Turn-On Delay Time (ns) 46
Typical Turn-Off Delay Time (ns) 325
Typical Fall Time (ns) 137
Typical Rise Time (ns) 62
Maximum Gate Source Leakage Current (nA) 10000
Maximum Gate Threshold Voltage (V) 1
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package VML
Basic Package Type Non-Lead-Frame SMT
Pin Count 3
Lead Shape No Lead
PCB 3
Tab N/R
Pin Pitch (mm) 0.35
Package Length (mm) 0.6
Package Width (mm) 0.8
Package Height (mm) 0.35
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.36
Mounting Surface Mount
Package Material N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material N/A
Terminal Base Material Cu


PACKAGING INFO
Packaging Suffix T2L
Packaging Tape and Reel
Quantity Of Packaging 8000


ECAD MODLES


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