S25FS064SDSBHN020 Infineon Technologies IC FLASH 64M SPI 80MHZ 24FBGA

label:
2025/09/18 18
S25FS064SDSBHN020 Infineon Technologies IC FLASH 64M SPI 80MHZ 24FBGA


CATALOG
S25FS064SDSBHN020 COUNTRY OF ORIGIN
S25FS064SDSBHN020 PARAMETRIC INFO
S25FS064SDSBHN020 PACKAGE INFO
S25FS064SDSBHN020 MANUFACTURING INFO
S25FS064SDSBHN020 PACKAGING INFO


COUNTRY OF ORIGIN
United States of America
Thailand


PARAMETRIC INFO
Density (bit) 64M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block No
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 8
Programmability Yes
Typical Operating Supply Voltage (V) 1.8
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Number of Bits per Word (bit) 1/2/4
Number of Words 64M/32M/16M
Maximum Supply Current (mA) 100
Programming Voltage (V) 1.7 to 2
Sector Size 64Kbyte x 128
Program Current (mA) 100
Address Width (bit) 32
Minimum Operating Supply Voltage (V) 1.7
Maximum Operating Supply Voltage (V) 2
Maximum Erase Time (s) 2.9/Sector
Maximum Programming Time (ms) 2/Page
Command Compatible Yes
ECC Support Yes
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface Yes
Support of Page Mode No
Page Size 256byte|512byte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 67108864
Process Technology 65nm


PACKAGE INFO
Supplier Package BGA
Basic Package Type Ball Grid Array
Pin Count 24
Lead Shape Ball
PCB 24
Tab N/R
Package Length (mm) 8
Package Width (mm) 6
Package Height (mm) 1.2(Max) - 0.2(Min)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Plastic Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3


PACKAGING INFO
Packaging Tray


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