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CATALOG
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S9KEAZ64AMLH COUNTRY OF ORIGIN
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S9KEAZ64AMLH PARAMETRIC INFO
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S9KEAZ64AMLH PACKAGE INFO
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S9KEAZ64AMLH MANUFACTURING INFO
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S9KEAZ64AMLH PACKAGING INFO
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COUNTRY OF ORIGIN
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China
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Philippines
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Data Bus Width (bit) |
32 |
| Family Name |
KEA |
| Device Core |
ARM Cortex M0+ |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
48 |
| Program Memory Type |
Flash |
| Program Memory Size |
64KB |
| RAM Size |
8KB |
| Maximum CPU Frequency (MHz) |
48 |
| Number of Programmable I/Os |
57 |
| Number of Timers |
4 |
| ADC Channels |
16 |
| ADC Resolution (bit) |
12 |
| Core Architecture |
ARM |
| Number of ADCs |
Single |
| PWM |
3 |
| Watchdog |
1 |
| Analog Comparators |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
I2C/SPI/UART |
| Programmability |
Yes |
| SPI |
2 |
| I2C |
2 |
| I2S |
0 |
| UART |
3 |
| USART |
0 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
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PACKAGE INFO
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| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1.45(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12 |
| Package Overall Width (mm) |
12 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BCD |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
800 |
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