S9KEAZN8ACFK NXP Semiconductors IC MCU 32BIT 8KB FLASH 24QFN

2025/05/22 102

• Operating characteristics– Voltage range: 2.7 to 5.5 V– Flash write voltage range: 2.7 to 5.5 V– Temperature range (ambient): -40 to 125°C

• Performance– Up to 48 MHz Arm® Cortex-M0+ core– Single cycle 32-bit x 32-bit multiplier– Single cycle I/O access port

• Memories and memory interfaces– Up to 8 KB flash– Up to 1 KB RAM

• Security and integrity modules– 80-bit unique identification (ID) number per chip

CATALOG

China

Family Name	KEA
Data Bus Width (bit)	32
Device Core	ARM Cortex M0+
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	48
Program Memory Type	Flash
Program Memory Size	8KB
RAM Size	1KB
Maximum CPU Frequency (MHz)	48
GPIO	22
Number of Timers	3
ADC Channels	12
ADC Resolution (bit)	12
Core Architecture	ARM
Number of ADCs	1
PWM	2
Watchdog	1
Analog Comparators	2
Parallel Master Port	No
Real Time Clock	Yes
Interface Type	I2C/SPI/UART
Programmability	Yes
SPI	1
I2C	1
I2S	0
UART	1
USART	0
CAN	0
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3.3\|5
Maximum Operating Supply Voltage (V)	5.5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Operating Supply Voltage (V)	3.3\|5
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

Supplier Package	QFN EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	24
Lead Shape	No Lead
PCB	24
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	4
Package Width (mm)	4
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	4
Package Overall Width (mm)	4
Package Overall Height (mm)	1(Max)
Seated Plane Height (mm)	1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Quad Flat No Lead Package, Exposed Pad
Package Family Name	QFN
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	40
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	N/A