SAK-XC2265N-40F80L Infineon Technologies IC MCU 16BIT 320KB FLASH 100LQFP

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2025/05/30 9
SAK-XC2265N-40F80L Infineon Technologies IC MCU 16BIT 320KB FLASH 100LQFP


CATALOG
SAK-XC2265N-40F80L PARAMETRIC INFO
SAK-XC2265N-40F80L PACKAGE INFO
SAK-XC2265N-40F80L MANUFACTURING INFO


PARAMETRIC INFO
Family Name XC2000
Data Bus Width (bit) 16|32
Device Core C166SV2
Instruction Set Architecture CISC|DSP|RISC
Maximum Clock Rate (MHz) 80
Program Memory Type Flash
Program Memory Size 320KB
RAM Size 42KB
Maximum Expanded Memory Size 16MB
Maximum CPU Frequency (MHz) 80
GPIO 76
Number of Timers 5
ADC Channels 5/5
ADC Resolution (bit) 10/10
Core Architecture C166
Number of ADCs 2
PWM 2
Watchdog 1
Interface Type CAN/I2C/SPI/UART
Programmability Yes
SPI 1
I2C 1
I2S 0
UART 1
USART 0
CAN 3
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 800
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Temperature Flag Opr
Operating Supply Voltage (V) 3.3|5


PACKAGE INFO
Supplier Package LQFP EP
Basic Package Type Lead-Frame SMT
Pin Count 100
Lead Shape Gull-wing
PCB 100
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 14
Package Width (mm) 14
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 16
Package Overall Width (mm) 16
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Low Profile Quad Flat Package, Exposed Pad
Package Family Name QFP
Jedec MO-204AD
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material N/A


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