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• Isolation Resistor, External 100Ω
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• Low Insertion Loss, 0.4 dB Typ.
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• Excellent Amplitude Unbalance, 0.1 dB Typ.
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• Excellent Phase Unbalance, 0.8 Deg. Typ.
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• High Isolation, 28 dB Typ.
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| CATALOG |
SCN-2-35+ COUNTRY OF ORIGIN
|
SCN-2-35+ PARAMETRIC INFO
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SCN-2-35+ PACKAGE INFO
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SCN-2-35+ MANUFACTURING INFO
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SCN-2-35+ PACKAGING INFO
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SCN-2-35+ APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Module/IC Classification |
IC |
| Number of Inputs |
1 |
| Number of Outputs |
2 |
| Frequency Range (MHz) |
2825 to 3700 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
100 |
| Number of Ports |
2 |
| Minimum Isolation (dB) |
18 |
| Input Signal Type |
Single-Ended |
| Output Signal Type |
Single-Ended |
| Maximum Input Power |
4W |
| Typical Insertion Loss (dB) |
0.4 |
| Typical Input Return Loss (dB) |
20 |
| Typical Output Return Loss (dB) |
23 |
| Output Impedance (Ohm) |
50 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
100 |
| Category |
Passive |
| Type |
Combiner/Splitter |
|
|
PACKAGE INFO
|
| Supplier Package |
Case FV1206-1 |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
No Lead |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.99 |
| Package Length (mm) |
3.2 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
0.89 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.2 |
| Package Overall Width (mm) |
1.6 |
| Package Overall Height (mm) |
0.89 |
| Seated Plane Height (mm) |
0.89 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.56 |
| Package Weight (g) |
0.02 |
| Package Material |
Ceramic |
| Package Description |
Ceramic Surface Mount Device |
| Package Family Name |
N/A |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1.07 |
| Minimum PACKAGE_DIMENSION_H |
0.71 |
| Maximum PACKAGE_DIMENSION_L |
3.35 |
| Minimum PACKAGE_DIMENSION_L |
3.05 |
| Maximum PACKAGE_DIMENSION_W |
1.75 |
| Minimum PACKAGE_DIMENSION_W |
1.45 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.07 |
| Minimum Seated_Plane_Height |
0.71 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
N/A |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.28 |
| Terminal Thickness (mm) |
0.89 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
245 to 250 |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Ag |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Index At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
|
| |
| APPLICATIONS |
| • Amateur Radio |
| • Defense |
| • Wireless Communication |
| |
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