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| CATALOG |
SF72S006VBDR2500 PARAMETRIC INFO
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SF72S006VBDR2500 PACKAGE INFO
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SF72S006VBDR2500 MANUFACTURING INFO
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SF72S006VBDR2500 PACKAGING INFO
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SF72S006VBDR2500 ECAD MODELS
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PARAMETRIC INFO
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| Type |
Nano SIM Card |
| Gender |
F |
| Number of Contacts |
6 |
| Termination Method |
Solder |
| Maximum Current Rating (A) |
0.5/Contact |
| Maximum Voltage Rating |
10V |
| Ejector Type |
Push-Push |
| Terminal Plating |
Gold Over Nickel |
| Contact Material |
Copper Alloy |
| Contact Plating |
Gold Over Nickel |
| Housing Material |
Glass Filled Liquid Crystal Polymer |
| Maximum Contact Resistance (mOhm) |
100 |
| Number of Rows |
2 |
| Operating Temperature (°C) |
-25 to 85 |
| Minimum Operating Temperature (°C) |
-25 |
| Maximum Operating Temperature (°C) |
85 |
| Mating Cycle (Cycles) |
5000 |
| PCB Mounting Side |
Normal |
| Maximum Terminal Coplanarity (mm) |
0.08 |
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PACKAGE INFO
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| Terminal Pitch (mm) |
2.54 |
| Body Orientation |
Straight |
| Mounting |
Surface Mount |
| Product Length (mm) |
11.2 |
| Product Depth (mm) |
14.35 |
| Product Height (mm) |
1.25 |
| Length Tolerance (mm) |
±0.1 |
| Depth Tolerance (mm) |
±0.1 |
| Height Tolerance (mm) |
±0.1 |
| Product Weight (g) |
N/A |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
N/A |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
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ECAD MODELS
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