SI2333-TP Micro Commercial Components (MCC) MOSFET P-CH 12V 6A SOT23

label:
2024/12/23 92
SI2333-TP Micro Commercial Components (MCC)  MOSFET P-CH 12V 6A SOT23


• Excellent RDS(ON)
• TrenchFET Power Mosfet
• Epoxy Meets UL 94 V-0 Flammability Rating
• Moisture Sensitivity Level 1
• Halogen Free. “Green” Device (Note 1)
• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information)


CATALOG
SI2333-TP COUNTRY OF ORIGIN
SI2333-TP PARAMETRIC INFO
SI2333-TP PACKAGE INFO
SI2333-TP MANUFACTURING INFO
SI2333-TP PACKAGING INFO


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 12
Maximum Continuous Drain Current (A) 6
Maximum Gate Source Voltage (V) ±8
Maximum Drain Source Resistance (mOhm) 28@4.5V
Typical Gate Charge @ Vgs (nC) 9.5@4.5V
Maximum Power Dissipation (mW) 1100
Process Technology TrenchFET
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 810@6V
Typical Turn-On Delay Time (ns) 7.1
Typical Turn-Off Delay Time (ns) 52
Typical Fall Time (ns) 26
Typical Rise Time (ns) 5.4
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 1.05(Max)
Package Length (mm) 3.04(Max)
Package Width (mm) 1.4(Max)
Package Height (mm) 1.1(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.25(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AA
Package Outline Link to Datasheet


MANUFACTURING INFO
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Number of Reflow Cycle 3
Standard N/A


PACKAGING INFO
Packaging Tape and Reel

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