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• Halogen-free According to IEC 61249-2-21 Definition
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• TrenchFET® Power MOSFETs
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• 175 °C Maximum Junction Temperature
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| • Compliant to RoHS Directive 2002/95/EC
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| • PWM Optimized |
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| CATALOG |
| SI4484EY-T1-E3 COUNTRY OF ORIGIN |
SI4484EY-T1-E3 PARAMETRIC INFO
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SI4484EY-T1-E3 PACKAGE INFO
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SI4484EY-T1-E3 MANUFACTURING INFO
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SI4484EY-T1-E3 PACKAGING INFO
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| COUNTRY OF ORIGIN |
| China |
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PARAMETRIC INFO
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| Channel Type |
N |
| Channel Mode |
Enhancement |
| Configuration |
Single Quad Drain Triple Source |
| Maximum Drain Source Voltage (V) |
100 |
| Maximum Continuous Drain Current (A) |
4.8 |
| Maximum Gate Source Voltage (V) |
±20 |
| Maximum Drain Source Resistance (mOhm) |
34@10V |
| Typical Gate Charge @ Vgs (nC) |
24@10V |
| Typical Gate Charge @ 10V (nC) |
24 |
| Maximum Power Dissipation (mW) |
3800 |
| Category |
Power MOSFET |
| Typical Turn-On Delay Time (ns) |
16 |
| Typical Turn-Off Delay Time (ns) |
35 |
| Typical Fall Time (ns) |
20 |
| Typical Rise Time (ns) |
10 |
| Number of Elements per Chip |
1 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
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PACKAGE INFO
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| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.55(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
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PACKAGING INFO
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| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
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