Si4500BDY-T1-E3 Vishay / Siliconix MOSFET N/P-CH 20V 6.6A 8SOIC

label:
2024/05/27 240

• Halogen-free According to IEC 61249-2-21 Definition
• TrenchFET® Power MOSFET
• Compliant to RoHS Directive 2002/95/EC
CATALOG
Si4500BDY-T1-E3 COUNTRY OF ORIGIN
SI4500BDY-T1-E3 LIFECYCLE
Si4500BDY-T1-E3 PARAMETRIC INFO
Si4500BDY-T1-E3 PACKAGE INFO
Si4500BDY-T1-E3 MANUFACTURING INFO
Si4500BDY-T1-E3 PACKAGING INFO
Si4500BDY-T1-E3 EACD MODELS



COUNTRY OF ORIGIN
China



LIFECYCLE
Obsolete
Jun 17,2015
PARAMETRIC INFO
Channel Type N|P
Channel Mode Enhancement
Configuration Dual Common Quad Drain
Maximum Drain Source Voltage (V) 20
Maximum Continuous Drain Current (A) 6.6@N Channel|3.8@P Channel
Maximum Gate Source Voltage (V) ±12
Maximum Drain Source Resistance (mOhm) 20@4.5V@N Channel|60@4.5V@P Channel
Typical Gate Charge @ Vgs (nC) 11@4.5V@N Channel|6@4.5V@P Channel
Maximum Power Dissipation (mW) 2500
Process Technology TrenchFET
Category Power MOSFET
Typical Turn-On Delay Time (ns) 35@N Channel|20@P Channel
Typical Turn-Off Delay Time (ns) 31@N Channel|55@P Channel
Typical Fall Time (ns) 15@N Channel|35@P Channel
Typical Rise Time (ns) 50@N Channel|35@P Channel
Number of Elements per Chip 2
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150



PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.55(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/R
Terminal Base Material Cu Olin 194



PACKAGING INFO
Packaging Tape and Reel



ECAD MODELS

Продукт RFQ