Si4850EY-T1-E3 Vishay Semiconductors MOSFET N-CH 60V 6A 8-SOIC

label:
2024/04/22 264

• Halogen-free According to IEC 61249-2-21 Definition
• TrenchFET® Power MOSFETs
• 175 °C Maximum Junction Temperature
•  Compliant to RoHS Directive 2002/95/EC
CATALOG
Si4850EY-T1-E3 COUNTRY OF ORIGIN
Si4850EY-T1-E3 PARAMETRIC INFO
Si4850EY-T1-E3 PACKAGE INFO
Si4850EY-T1-E3 MANUFACTURING INFO
Si4850EY-T1-E3 PACKAGING INFO
Si4850EY-T1-E3 EACD MODELS


 
COUNTRY OF ORIGIN
China


 
PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single Quad Drain Triple Source
Maximum Drain Source Voltage (V) 60
Maximum Continuous Drain Current (A) 6
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 22@10V
Typical Gate Charge @ Vgs (nC) 18@10V
Typical Gate Charge @ 10V (nC) 18
Operating Junction Temperature (°C) -55 to 175
Maximum Power Dissipation (mW) 3300
Process Technology TrenchFET
Category Power MOSFET
Typical Output Capacitance (pF) 110
Typical Gate to Drain Charge (nC) 5.3
Typical Gate to Source Charge (nC) 3.4
Maximum Junction Ambient Thermal Resistance 90°C/W
Typical Gate Resistance (Ohm) 1.4
Typical Forward Transconductance (S) 25
Typical Turn-On Delay Time (ns) 10
Typical Turn-Off Delay Time (ns) 25
Typical Fall Time (ns) 12
Typical Rise Time (ns) 10
Maximum Gate Threshold Voltage (V) 3
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 175
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 175


 
PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.55(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/R
Terminal Base Material Cu Olin 194


 
PACKAGING INFO
Packaging Tape and Reel


 
ECAD MODELS




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