SI7119DN-T1-GE3 Vishay Semiconductors MOSFET P-CH 200V 3.8A 1212-8

label:
2023/09/13 339


• Halogen-free According to IEC 61249-2-21 Available
• TrenchFET® Power MOSFET
• Low Thermal Resistance PowerPAK® Package with Small Size and Low 1.07 mm Profile
• 100 % UIS and Rg Tested


CATALOG
SI7119DN-T1-GE3 COUNTRY OF ORIGIN
SI7119DN-T1-GE3 PARAMETRIC INFO
SI7119DN-T1-GE3 PACKAGE INFO
SI7119DN-T1-GE3 MANUFACTURING INFO
SI7119DN-T1-GE3 PACKAGING INFO
SI7119DN-T1-GE3 APPLICATIONS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single Quad Drain Triple Source
Maximum Drain Source Voltage (V) 200
Maximum Continuous Drain Current (A) 1.2
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 1050@10V
Typical Gate Charge @ Vgs (nC) 16.2@10V|10.6@6V
Typical Gate Charge @ 10V (nC) 16.2
Maximum Power Dissipation (mW) 3700
Process Technology TrenchFET
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 666@50V
Typical Turn-On Delay Time (ns) 9|16
Typical Turn-Off Delay Time (ns) 25|27
Typical Fall Time (ns) 12|16
Typical Rise Time (ns) 16|11
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -50
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -50
Maximum Operating Temperature (°C) 150
 

PACKAGE INFO
Supplier Package PowerPAK 1212
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3.05
Package Width (mm) 3.05
Package Height (mm) 1.07(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.3
Package Overall Width (mm) 3.3
Package Overall Height (mm) 1.04
Seated Plane Height (mm) 1.04
Mounting Surface Mount
Package Material Plastic
Package Family Name PowerPAK 1212
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/R
Terminal Base Material Cu Olin 194
 

PACKAGING INFO
Packaging Tape and Reel
 

APPLICATIONS
• Active Clamp in Intermediate DC/DC Power Supplies  


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