| Channel Type |
P |
| Channel Mode |
Enhancement |
| Configuration |
Single Quad Drain Triple Source |
| Maximum Drain Source Voltage (V) |
150 |
| Material |
Si |
| Maximum Continuous Drain Current (A) |
2.8 |
| Maximum Absolute Continuous Drain Current (A) |
2.8 |
| Maximum Gate Source Voltage (V) |
±30 |
| Maximum Drain Source Resistance (mOhm) |
1200@10V |
| Typical Gate Charge @ Vgs (nC) |
6.5@10V |
| Typical Gate Charge @ 10V (nC) |
6.5 |
| Maximum Power Dissipation (mW) |
3200 |
| Process Technology |
TrenchFET |
| Category |
Power MOSFET |
| Typical Input Capacitance @ Vds (pF) |
243@75V |
| Typical Turn-On Delay Time (ns) |
7 |
| Typical Turn-Off Delay Time (ns) |
11 |
| Typical Fall Time (ns) |
10 |
| Typical Rise Time (ns) |
11 |
| Maximum Gate Source Leakage Current (nA) |
100 |
| Maximum Gate Threshold Voltage (V) |
4.5 |
| Maximum IDSS (uA) |
1 |
| Number of Elements per Chip |
1 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
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