 |
|
| • Halogen-free According to IEC 61249-2-21
Available |
| • TrenchFET® Power MOSFETs |
| • New Low Thermal Resistance PowerPAK®
Package with Low 1.07 mm Profile |
| • PWM Optimized for Fast Switching |
| • 100 % Rg Tested |
|
| CATALOG |
| SI7456DP-T1-GE3 COUNTRY OF ORIGIN |
| SI7456DP-T1-GE3 PARAMETRIC INFO |
| SI7456DP-T1-GE3 PACKAGE INFO |
| SI7456DP-T1-GE3 MANUFACTURING INFO |
| SI7456DP-T1-GE3 PACKAGING INFO |
| SI7456DP-T1-GE3 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
|
| PARAMETRIC INFO |
| Channel Type |
N |
| Channel Mode |
Enhancement |
| Configuration |
Single Quad Drain Triple Source |
| Maximum Drain Source Voltage (V) |
100 |
| Maximum Continuous Drain Current (A) |
5.7 |
| Maximum Gate Source Voltage (V) |
±20 |
| Maximum Drain Source Resistance (mOhm) |
25@10V |
| Typical Gate Charge @ Vgs (nC) |
36@10V |
| Typical Gate Charge @ 10V (nC) |
36 |
| Maximum Power Dissipation (mW) |
5200 |
| Process Technology |
TrenchFET |
| Category |
Power MOSFET |
| Typical Turn-On Delay Time (ns) |
14 |
| Typical Turn-Off Delay Time (ns) |
46 |
| Typical Fall Time (ns) |
26 |
| Typical Rise Time (ns) |
10 |
| Maximum Gate Source Leakage Current (nA) |
100 |
| Maximum Gate Threshold Voltage (V) |
4 |
| Maximum IDSS (uA) |
1 |
| Number of Elements per Chip |
1 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
PowerPAK SO |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
5.89 |
| Package Height (mm) |
1.07(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.15 |
| Package Overall Width (mm) |
6.15 |
| Package Overall Height (mm) |
1.04 |
| Seated Plane Height (mm) |
1.04 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
N/A |
| Package Family Name |
N/A |
| Jedec |
N/A |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
|
| |
| PACKAGING INFO |
|
|
| |
| APPLICATIONS |
| • Primary Side Switch for High Density DC/DC |
| • Telecom/Server 48 V, Full-/Half-Bridge DC/DC |
| • Industrial and 42 V Automotive
|
|
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