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• Broadband operation: 0.01 to 4.0 GHz
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• Attenuation range: 31.75 dB with 0.25 dB LSB
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• TTL/CMOS-compatible serial, parallel, or latched parallel control interface
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• Single supply voltage: +3.3 or +5 V
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• Small QFN (32-pin, 5 x 5 mm) Pb-free package (MSL1, 260 C per JEDEC J-STD-020)
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CATALOG |
SKY12343-364LF LIFECYCLE
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SKY12343-364LF COUNTRY OF ORIGIN
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SKY12343-364LF PARAMETRIC INFO
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SKY12343-364LF PACKAGE INFO
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SKY12343-364LF MANUFACTURING INFO
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SKY12343-364LF APPLICATIONS
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LIFECYCLE
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Obsolete
Nov 17,2021
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COUNTRY OF ORIGIN
|
Malaysia
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PARAMETRIC INFO
|
Number of Bits |
7 |
Maximum Attenuation (dB) |
31.75 |
Attenuator Step Size (dB) |
0.25 |
Minimum Frequency (MHz) |
100 |
Maximum Frequency (MHz) |
4000 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Operating Supply Voltage (V) |
3.3 |
Typical Operating Supply Voltage (V) |
5 |
Maximum Operating Supply Voltage (V) |
6 |
Minimum Setup Time (ns) |
10 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
|
Supplier Package |
QFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
32 |
Lead Shape |
No Lead |
PCB |
32 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
5 |
Package Width (mm) |
5 |
Package Height (mm) |
0.88 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
0.9 |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu |
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APPLICATIONS
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• Cellular and 3G infrastructure
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• WiMAX, LTE, 4G infrastructure
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