
|
|
• Broadband operation: 0.01 to 4.0 GHz
|
• Attenuation range: 31.75 dB with 0.25 dB LSB
|
• TTL/CMOS-compatible serial, parallel, or latched parallel control interface
|
• Single supply voltage: +3.3 or +5 V
|
• Small QFN (32-pin, 5 x 5 mm) Pb-free package (MSL1, 260 C per JEDEC J-STD-020)
|
|
| CATALOG |
SKY12343-364LF LIFECYCLE
|
SKY12343-364LF COUNTRY OF ORIGIN
|
SKY12343-364LF PARAMETRIC INFO
|
SKY12343-364LF PACKAGE INFO
|
SKY12343-364LF MANUFACTURING INFO
|
SKY12343-364LF APPLICATIONS
|
|
LIFECYCLE
|
Obsolete
Nov 17,2021
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Number of Bits |
7 |
| Maximum Attenuation (dB) |
31.75 |
| Attenuator Step Size (dB) |
0.25 |
| Minimum Frequency (MHz) |
100 |
| Maximum Frequency (MHz) |
4000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
3.3 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Supply Voltage (V) |
6 |
| Minimum Setup Time (ns) |
10 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
No Lead |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
|
|
APPLICATIONS
|
• Cellular and 3G infrastructure
|
• WiMAX, LTE, 4G infrastructure
|
|