 |
|
| • Broadband frequency range: 0.1 to 6.0 GHz |
| • Low insertion loss: 0.6 dB typical @ 5.0 GHz |
| • High isolation: >26 dB @ 2.7 GHz |
| • Integrated logic |
| • Small QFN (14-pin, 2.0 x 2.0 mm) package
(MSL1, 260 C per JEDEC J-STD-020) |
|
| CATALOG |
| SKY13416-485LF COUNY OP ORIGIN |
| SKY13416-485LF PARAMETRIC INFO |
| SKY13416-485LF PACKAGE INFO |
| SKY13416-485LF MANUFACTURING INFO |
| SKY13416-485LF PACKAGING INFO |
| SKY13416-485LF ECAD MODELS |
| SKY13416-485LF FUNCTONAL BLOCK DIAGRAM |
|
| COUNY OP ORIGIN |
| China |
|
| PARAMETRIC INFO |
| Switch Type |
SP6T |
| Number of Switches |
1 |
| Switch Configuration |
Single SP6T |
| Frequency Band (MHz) |
100 to 6000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Insertion Loss (dB) |
0.95 |
| Typical Operating Supply Voltage (V) |
3 |
| Maximum Frequency (MHz) |
6000 |
| Technology |
CMOS/TTL |
| Switching Speed (ns) |
2200 |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
4.8 |
| Operating Supply Voltage (V) |
3 |
| High Control Voltage (V) |
1.35 to 3 |
| Minimum Isolation Voltage (dB) |
22 |
| Typical Supply Current (mA) |
0.05 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
| PACKAGE INFO |
| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
No Lead |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.45 |
| Package Length (mm) |
2 |
| Package Width (mm) |
2 |
| Package Height (mm) |
0.53 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.55 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
|
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000|3000 |
| Reel Diameter (in) |
7|13 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| ECAD MODELS |
 |
|
| FUNCTONAL BLOCK DIAGRAM |
 |
|
One-stop supplier of IC products