|
|
• Spur-free operation
|
• 2.1 GHz maximum operating frequency
|
• Ultra-fine step size, 100 Hz or less
|
• Very fast switching speed (e.g., below 100 µs)
|
• Software programmable power-down modes
|
• High-speed serial interface up to 100 Mbps
|
• Three-wire programming
|
|
| CATALOG |
SKY72310-362LF LIFECYCLE
|
SKY72310-362LF PARAMETRIC INFO
|
SKY72310-362LF PACKAGE INFO
|
SKY72310-362LF MANUFACTURING INFO
|
SKY72310-362LF APPLICATIONS
|
|
LIFECYCLE
|
Obsolete
Dec 31,2015
|
|
PARAMETRIC INFO
|
| Number of Outputs per Chip |
1 |
| Clock Input Frequency (MHz) |
Up to 50 |
| Maximum Operating Supply Voltage (V) |
3.3 |
| Number of Clock Inputs |
0 |
| Spread Spectrum |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220VGGD-6 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
|
APPLICATIONS
|
• General purpose RF systems
|
• 2.5G and 3G wireless infrastructure
|
• Broadband wireless access
|
• Low bit rate wireless telemetry
|
| • Instrumentation |
| • L-band receivers |
| • Satellite communications |
|
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