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• AEC-Q101 qualified
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• Peak pulse power:– 3000 W (10/1000 μs)– up to 40 kW (8/20 μs)
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• Stand-off voltage range from 5 V to 188 V
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| • Unidirectional and bidirectional types
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• Low leakage current: 0.2 µA at 25 °C
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| • Operating Tj max: 175 °C |
| • JEDEC registered package outline |
| • Lead finishing: matte tin plating |
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| CATALOG |
| SM30T23AY COUNTRY OF ORIGIN |
SM30T23AY PARAMETRIC INFO
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SM30T23AY PACKAGE INFO
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SM30T23AY MANUFACTURING INFO
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SM30T23AY PACKAGING INFO
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SM30T23AY EACD MODELS
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|
| COUNTRY OF ORIGIN |
| China |
|
PARAMETRIC INFO
|
| Configuration |
Single |
| Direction Type |
Uni-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
20 |
| Minimum Breakdown Voltage (V) |
22.2 |
| Maximum Clamping Voltage (V) |
32.4 |
| Maximum Reverse Leakage Current (uA) |
0.2 |
| Maximum Breakdown Voltage (V) |
24.6 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
93 |
| Test Current (mA) |
1 |
| Operating Junction Temperature (°C) |
-55 to 175 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
175 |
| Peak Pulse Power Dissipation (W) |
3000 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
| Supplier Temperature Grade |
Automotive |
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|
PACKAGE INFO
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| Supplier Package |
SMC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
7.15(Max) |
| Package Width (mm) |
6.25(Max) |
| Package Height (mm) |
2.45(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
8.15(Max) |
| Package Overall Width (mm) |
6.25(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO-214-AB |
| Jedec |
DO-214AB |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
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| ECAD MODELS |
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