|
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• Junction passivation optimized design passivated anisotropic rectifier technology
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• TJ = 175 °C capability suitable for high reliability and automotive requirement
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• Low leakage current
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• Low forward voltage drop
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• High surge capability
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• Meets ISO7637-2 surge specification
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• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C
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• AEC-Q101 qualified
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|
| CATALOG |
SM5A27HE3/2D COUNTRY OF ORIGIN
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SM5A27HE3/2D PARAMETRIC INFO
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SM5A27HE3/2D PACKAGE INFO
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SM5A27HE3/2D MANUFACTURING INFO
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SM5A27HE3/2D PACKAGING INFO
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SM5A27HE3/2D ECAD MODELS
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SM5A27HE3/2D TYPICAL APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Configuration |
Single |
| Direction Type |
Uni-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
22 |
| Minimum Breakdown Voltage (V) |
24 |
| Maximum Clamping Voltage (V) |
40 |
| Maximum Reverse Leakage Current (uA) |
0.2 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
55 |
| Test Current (mA) |
10 |
| Operating Junction Temperature (°C) |
-55 to 175 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
175 |
| Peak Pulse Power Dissipation (W) |
3600 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
|
|
PACKAGE INFO
|
| Supplier Package |
DO-218AB |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
1 |
| Tab |
Tab |
| Pin Pitch (mm) |
N/A |
| Package Length (mm) |
13.7(Max) |
| Package Width (mm) |
8.7(Max) |
| Package Height (mm) |
5(Max) - 0.4(Min) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
16(Max) |
| Package Overall Width (mm) |
10.5(Max) |
| Package Overall Height (mm) |
5.5(Max) |
| Seated Plane Height (mm) |
5.5(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-218AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
750 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| TYPICAL APPLICATIONS |
Use in sensitive electronics protection against voltage
transients induced by inductive load switching and lighting,
especially for automotive load dump protection application. |
| |
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