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| |
• Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs)
|
• Stand-off voltage range from 5 V to 188 V
|
• Unidirectional and bidirectional types
|
| • Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C |
| • Operating Tjmax: 150 °C |
| • High power capability at Tj max.: up to 515 W (10/1000 µs) |
| • Lead finishing: matte tin plating |
| |
| CATALOG |
| SMBJ24A-TR COUNTRY OF ORIGIN |
SMBJ24A-TR PARAMETRIC INFO
|
SMBJ24A-TR PACKAGE INFO
|
SMBJ24A-TR MANUFACTURING INFO
|
SMBJ24A-TR PACKAGING INFO
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SMBJ24A-TR EACD MODELS
|
|
| COUNTRY OF ORIGIN |
| China |
|
PARAMETRIC INFO
|
| Configuration |
Single |
| Direction Type |
Uni-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
24 |
| Minimum Breakdown Voltage (V) |
26.7 |
| Maximum Clamping Voltage (V) |
38.9 |
| Maximum Reverse Leakage Current (uA) |
0.2 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
16 |
| Test Current (mA) |
1 |
| Operating Junction Temperature (°C) |
-55 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Peak Pulse Power Dissipation (W) |
600 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Industrial |
| Tradename |
Transil™ |
|
|
PACKAGE INFO
|
| Supplier Package |
SMB |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.6(Max) |
| Package Width (mm) |
3.95(Max) |
| Package Height (mm) |
2.45(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.6(Max) |
| Package Overall Width (mm) |
3.95(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-214AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
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ECAD MODELS
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|
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