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• 600 W peak pulse powercapability at 10/1000 μswaveform, repetition rate(duty cycles):0.01 %
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• For surface mounted
applications to optimize
board space
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• Low dynamic resistance
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• Typical failure mode is short from over-specified voltage or current
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• IEC-61000-4-2 ESD 30 kV(Air), 30 kV (Contact)
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| CATALOG |
SMBJ36A COUNTRY OF ORIGIN
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SMBJ36A PARAMETRIC INFO
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SMBJ36A PACKAGE INFO
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SMBJ36A MANUFACTURING INFO
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SMBJ36A PACKAGING INFO
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SMBJ36A ECAD MODELS
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SMBJ36A APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Philippines
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PARAMETRIC INFO
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| Configuration |
Single |
| Direction Type |
Uni-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
36 |
| Minimum Breakdown Voltage (V) |
40 |
| Maximum Clamping Voltage (V) |
58.1 |
| Maximum Reverse Leakage Current (uA) |
1 |
| Maximum Breakdown Voltage (V) |
44.2 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
10.4 |
| Test Current (mA) |
1 |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
175 |
| Maximum Power Dissipation (mW) |
5000 |
| Maximum Forward Voltage (V) |
3.5 |
| Peak Pulse Power Dissipation (W) |
600 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
| Peak Forward Surge Current (A) |
100 |
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PACKAGE INFO
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| Supplier Package |
SMB |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.75(Max) |
| Package Width (mm) |
3.94(Max) |
| Package Height (mm) |
2.41(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.59(Max) |
| Package Overall Width (mm) |
3.94(Max) |
| Package Overall Height (mm) |
2.61(Max) |
| Seated Plane Height (mm) |
2.61(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
2.2(Max) |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-214AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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| APPLICATIONS |
| TVS components are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. |
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