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• 3000W PPPM capability at 10/1000μs waveform,repetition rate (duty cycles):0.01%
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• For surface mounted applications in order to optimize board space
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• Low profile package
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| • Typical failure mode is short from over-specified voltage or current |
| • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c |
| • IEC-61000-4-2 ESD 30kV(Air),30kV (Contact) |
| • ESD protection of data lines in accordance with IEC 61000-4-2 |
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| CATALOG |
| SMDJ30CA COUNTRY OF ORIGIN |
SMDJ30CA PARAMETRIC INFO
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SMDJ30CA PACKAGE INFO
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SMDJ30CA MANUFACTURING INFO
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SMDJ30CA PACKAGING INFO
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SMDJ30CA EACD MODELS
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| SMDJ30CA APPLICATIONS |
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| COUNTRY OF ORIGIN |
| China |
| Philippines |
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PARAMETRIC INFO
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| Configuration |
Single |
| Direction Type |
Bi-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
30 |
| Minimum Breakdown Voltage (V) |
33.3 |
| Maximum Clamping Voltage (V) |
48.4 |
| Maximum Reverse Leakage Current (uA) |
2 |
| Maximum Breakdown Voltage (V) |
36.8 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
62 |
| Test Current (mA) |
1 |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
175 |
| Peak Pulse Power Dissipation (W) |
3000 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SMC |
| Pin Count |
2 |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
7.11(Max) |
| Package Width (mm) |
6.22(Max) |
| Package Height (mm) |
2.42(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
8.13(Max) |
| Package Overall Width (mm) |
6.22(Max) |
| Package Overall Height (mm) |
2.62(Max) |
| Seated Plane Height (mm) |
2.62(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.21 |
| Package Material |
Plastic |
| Jedec |
DO-214AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • TVS components are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in telecom, computer, Industrial and consumer electronic applications.
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