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• Protects up to 5−Line in a Single SC−88 Package
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• Peak Power Dissipation − 100 W (8 x 20 s Waveform)
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• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model and Class C (Exceeding 400 V) per Machine Model.
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| • Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8 kV (Contact)
|
| • Flammability Rating of UL 94 V−0 |
| • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable |
| • Pb−Free Packages are Available* |
|
| CATALOG |
| SMF05CT1G COUNTRY OF ORIGIN |
SMF05CT1G PARAMETRIC INFO
|
SMF05CT1G PACKAGE INFO
|
SMF05CT1G MANUFACTURING INFO
|
SMF05CT1G PACKAGING INFO
|
SMF05CT1G EACD MODELS
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| SMF05CT1G APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
PARAMETRIC INFO
|
| type |
TVS |
| Direction Type |
Uni-Directional |
| Maximum Working Voltage (V) |
5 |
| Configuration |
Quint Common Anode |
| Maximum Clamping Voltage (V) |
12.5 |
| Maximum Leakage Current (uA) |
5 |
| Operating Junction Temperature (°C) |
-40 to 125 |
| Number of Elements per Chip |
5 |
| Maximum Breakdown Voltage (V) |
7.2 |
| Test Current (mA) |
1 |
| Peak Pulse Power Dissipation (W) |
100 |
| Maximum Peak Pulse Current (A) |
8 |
| Minimum Breakdown Voltage (V) |
6.2 |
| Minimum Operating Temperature (°C) |
-40 |
| Fail Safe Protection |
no |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier packaging |
SC-88 |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
6 |
| PCB |
6 |
| ears |
N/R |
| Pin spacing (mm) |
0.65 |
| Package length (mm) |
2 |
| Package width (mm) |
1.25 |
| Package height (mm) |
0.9 |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
2 |
| Package Overall Width (mm) |
2.1 |
| Package Overall Height (mm) |
1.1(Max) |
| Mounting surface height (mm) |
1.1(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| Package series name |
SOT |
| JEDEC |
not applicable |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
not applicable |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Terminal Base Material |
CuFeAgZn |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T1 |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| packaging type file |
Link to datasheet |
|
|
ECAD MODELS
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|
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APPLICATIONS
|
• Hand−Held Portable Applications
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| • Networking and Telecom |
| • Automotive Electronics |
| • Serial and Parallel Ports |
| • Notebooks, Desktops, Servers |
| |
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