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• 200W peak pulsepower capability at 10/1000µs waveform, repetition rate(duty cycle): 0.01%
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• Compatible with industrial standard package SOD-123FL
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• Low profile: maximum height of 1.1mm.
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| • Low inductance, excellent clamping capability |
| • For surface mounted applications to optimize board space |
| • High temperature to reflow soldering guaranteed: 260°C/30sec |
| • Typical failure mode is short from over-specified voltage or current |
| • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c |
| • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) |
| • ESD protection of data lines in accordance with IEC 61000-4-2 |
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| CATALOG |
| SMF6.5A COUNTRY OF ORIGIN |
SMF6.5A PARAMETRIC INFO
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SMF6.5A PACKAGE INFO
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SMF6.5A MANUFACTURING INFO
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SMF6.5A PACKAGING INFO
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SMF6.5A EACD MODELS
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| SMF6.5A APPLICATIONS |
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| COUNTRY OF ORIGIN |
| China |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Configuration |
Single |
| Direction Type |
Uni-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
6.5 |
| Minimum Breakdown Voltage (V) |
7.22 |
| Maximum Clamping Voltage (V) |
11.2 |
| Maximum Reverse Leakage Current (uA) |
250 |
| Maximum Breakdown Voltage (V) |
7.98 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
17.9 |
| Test Current (mA) |
10 |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
175 |
| Maximum Power Dissipation (mW) |
1000 |
| Peak Pulse Power Dissipation (W) |
200 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
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|
PACKAGE INFO
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| Supplier Package |
SOD-123F |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Flat |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2.9(Max) |
| Package Width (mm) |
2(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
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ECAD MODELS
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| APPLICATIONS |
• SMF series is ideal for the protection of I/O interfaces, VCC bus and
other vulnerable circuit used in cellular phones, portable
electronics, business machines, power supplies and other
consumer applications. |
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