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| CATALOG |
SN65DSI83TPAPRQ1 COUNTRY OF ORIGIN
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SN65DSI83TPAPRQ1 PARAMETRIC INFO
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SN65DSI83TPAPRQ1 PACKAGE INFO
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SN65DSI83TPAPRQ1 MANUFACTURING INFO
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SN65DSI83TPAPRQ1 PACKAGING INFO
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SN65DSI83TPAPRQ1 ECAD MODELS
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SN65DSI83TPAPRQ1 APPLICATIONS
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COUNTRY OF ORIGIN
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Philippines
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China
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PARAMETRIC INFO
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| Function |
Receiver |
| Number of Drivers |
0 |
| Number of Receivers |
1 |
| Input Signal Type |
MIPI D-PHY |
| Transmission Data Rate (Mbps) |
1000 |
| Number of Elements per Chip |
1 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Typical Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
1.95 |
| Output Signal Type |
LVDS |
| Minimum Operating Frequency (MHz) |
25 |
| Maximum Operating Frequency (MHz) |
154 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
HTQFP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10.2(Max) |
| Package Width (mm) |
10.2(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12.2(Max) |
| Package Overall Width (mm) |
12.2(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Quad Flat Package, Exposed Pad |
| Package Family Name |
QFP |
| Jedec |
MS-026ACD |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Infotainment Head Unit With Integrated Display
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| • Infotainment Head Unit With Remote Display
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| • Infotainment Rear-Seat Entertainment |
| • Hybrid Automotive Cluster |
• Portable Navigation Device
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• Navigation
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| •Industrial Human Machine Interface (HMI) and
Displays
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