|
|
• Single 3.3-V Supply Voltage
|
• Bus Pins Fault Protection Exceeds ±36 V
|
• Bus Pins ESD Protection Exceeds ±16 kV HBM
|
| • Compatible With ISO 11898-2 |
| • GIFT/ICT Compliant |
| • Data Rates up to 1 Mbps |
| • Extended –7 V to 12 V Common Mode Range
|
| • High-Input Impedance Allows for 120 Nodes
|
| • LVTTL I/Os are 5-V Tolerant |
| • Adjustable Driver Transition Times for Improved
Emissions Performance
|
| • Unpowered Node Does Not Disturb the Bus
|
| • Low Current Standby Mode, 200-μA (Typical) |
| • SN65HVD233: Loopback Mode |
|
| CATALOG |
| SN65HVD234D COUNTRY OF ORIGIN |
SN65HVD234D PARAMETRIC INFO
|
SN65HVD234D PACKAGE INFO
|
SN65HVD234D MANUFACTURING INFO
|
SN65HVD234D PACKAGING INFO
|
SN65HVD234D ECAD MODELS
|
SN65HVD234D APPLICATIONS
|
|
| COUNTRY OF ORIGIN |
| Mexico |
|
PARAMETRIC INFO
|
| Category |
Transceiver |
| Maximum Data Rate |
1Mbps |
| Standard Supported |
ISO 11898 |
| Number of Transceivers |
1 |
| Power Down Mode |
Sleep|Standby |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Storage Temperature (°C) |
125 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Supply Current (mA) |
6 |
| Manufacture Type |
High Speed CAN Transceiver |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
75 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Industrial Automation, Control, Sensors, and Drive
Systems
|
• Motor and Robotic Control
|
| • Building and Climate Control (HVAC)
|
| • Backplane Communication and Control
|
| • CAN Bus Standards such as CANopen,
DeviceNet, CAN Kingdom, NMEA 2000,
SAE J1939 |
|
| |
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