 |
|
| • Single 3.3-V Supply Voltage
|
| • Bus Pins Fault Protection Exceeds ±36 V |
| • Bus Pins ESD Protection Exceeds ±16 kV HBM |
| • Compatible With ISO 11898-2 |
| • GIFT/ICT Compliant |
| • Data Rates up to 1 Mbps
|
| • Extended –7 V to 12 V Common Mode Range |
| • High-Input Impedance Allows for 120 Nodes |
| • LVTTL I/Os are 5-V Tolerant |
| • Adjustable Driver Transition Times for Improved
Emissions Performance
|
| • Unpowered Node Does Not Disturb the Bus |
| • Low Current Standby Mode, 200-μA (Typical) |
| • SN65HVD233: Loopback Mode |
• SN65HVD234: Ultra Low Current Sleep Mode
– 50-nA Typical Current Consumption |
| • SN65HVD235: Autobaud Loopback Mode |
| • Thermal Shutdown Protection |
• Power up and Down With Glitch-Free Bus Inputs
and Outputs
– High-Input Impedance With Low VCC
– Monolithic Output During Power Cycling |
|
| CATALOG |
| SN65HVD234DR COUNTRY OF ORIGIN |
| SN65HVD234DR PARAMETRIC INFO |
| SN65HVD234DR PACKAGE INFO |
| SN65HVD234DR MANUFACTURING INFO |
| SN65HVD234DR PACKAGING INFO |
| SN65HVD234DR ECAD MODELS |
| SN65HVD234DR FUNCTIONAL BLOCK DIAGRAMS |
| SN65HVD234DR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Mexico |
|
| PARAMETRIC INFO |
| Category |
Transceiver |
| Maximum Data Rate |
1Mbps |
| Standard Supported |
ISO 11898 |
| Number of Transceivers |
1 |
| Power Down Mode |
Sleep|Standby |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Storage Temperature (°C) |
125 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Supply Current (mA) |
6 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAMS |
 |
|
| APPLICATIONS |
| • Industrial Automation, Control, Sensors, and Drive
Systems |
| • Motor and Robotic Control |
| • Building and Climate Control (HVAC) |
| • Backplane Communication and Control |
| • CAN Bus Standards such as CANopen,
DeviceNet, CAN Kingdom, NMEA 2000,
SAE J1939 |
|
One-stop supplier of IC products