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• Meets the Requirements of ISO11898-2
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• I/O Voltage Range Supports 3.3-V and 5-V MCUs
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• Characterized for –40°C to 125°C Operation
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|
| CATALOG |
| SN65HVD256DR COUNTRY OF ORIGIN |
SN65HVD256DR PARAMETRIC INFO
|
SN65HVD256DR PACKAGE INFO
|
SN65HVD256DR MANUFACTURING INFO
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SN65HVD256DR PACKAGING INFO
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SN65HVD256DR ECAD MODELS
|
SN65HVD256DR BLOCK DIAGRAM
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SN65HVD256DR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
| Mexico |
|
PARAMETRIC INFO
|
| Category |
Transceiver |
| Maximum Data Rate |
1Mbps |
| Standard Supported |
ISO 11898-2 |
| Number of Transceivers |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Typical Operating Supply Voltage (V) |
5 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
180 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

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|
BLOCK DIAGRAM
|

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APPLICATIONS
|
• 1-Mbps Operation in Highly Loaded CAN
Networks Down to 10-kbps Networks Using TXD
DTO
|
• Industrial Automation, Control, Sensors, and Drive
Systems
|
• Building, Security, and Climate Control
Automation
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• Telecom Base Station Status and Control
|
• SN65HVD257: Functional Safety With Redundant
and Multitopology CAN networks
|
• CAN Bus Standards Such as CANopen, DeviceNet,NMEA2000,ARNIC825, ISO11783,and CANaerospace
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