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• Single Lane USB 3.0 Equalizer, Redriver
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• Selectable Equalization, De-Emphasis and Output Swing Control
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• Integrated Termination
|
• Hot-Plug Capable
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• Low Active Power (U0 state)– 315 mW (Typical), VCC = 3.3 V
|
• USB 3.0 Low Power Support– 7 mW (Typical) When No Connection Detected– 70 mW (Typical) When Link in U2, U3 Mode
|
|
| CATALOG |
SN65LVPE512RGER COUNTRY OF ORIGIN
|
SN65LVPE512RGER PARAMETRIC INFO
|
SN65LVPE512RGER PACKAGE INFO
|
SN65LVPE512RGER MANUFACTURING INFO
|
SN65LVPE512RGER PACKAGING INFO
|
SN65LVPE512RGER ECAD MODELS
|
SN65LVPE512RGER APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Philippines
|
|
PARAMETRIC INFO
|
| Typical Supply Current (mA) |
100 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Protocols Supported |
USB 3.0 |
| Maximum Data Rate (Mbps) |
5000 |
| USB Speed Type |
High Speed|Super Speed |
| Type |
Dual Channel Redriver |
| USB Transceiver |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4.15(Max) |
| Package Width (mm) |
4.15(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.15(Max) |
| Package Overall Width (mm) |
4.15(Max) |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Notebooks |
| • Desktops |
| • Docking Stations |
| • Active Cables |
| • Backplane |
| • Active Cables |
| |
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