SN74ACT245DWR Texas Instruments IC TXRX NON-INVERT 5.5V 20SOIC

label:
2025/06/3 9
SN74ACT245DWR Texas Instruments IC TXRX NON-INVERT 5.5V 20SOIC


• VCC operation of 4.5V to 5.5V
• Inputs accept voltages to 5.5V
• Max tpd of 8ns at 5V
• Inputs are TTL-voltage compatible


CATALOG
SN74ACT245DWR COUNTRY OF ORIGIN
SN74ACT245DWR PARAMETRIC INFO
SN74ACT245DWR PACKAGE INFO
SN74ACT245DWR MANUFACTURING INFO
SN74ACT245DWR PACKAGING INFO
SN74ACT245DWR ECAD MODELS
SN74ACT245DWR  APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Malaysia


PARAMETRIC INFO
Logic Family ACT
Logic Function Bus Transceiver
Data Flow Direction Bi-Directional
Number of Direction Control Inputs 1 Low/High
Number of Elements per Chip 1
Number of Channels per Chip 8
Number of Selection Inputs per Element 0
Number of Input Enables per Element 0
Number of Output Enables per Element 1 Low
Output Type 3-State
Polarity Non-Inverting
Input Level TTL
Output Level CMOS
Bus Hold No
Process Technology CMOS
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Minimum Operating Supply Voltage (V) 4.5
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 5
Maximum High Level Output Current (mA) -24
Maximum Low Level Output Current (mA) 24
Maximum Quiescent Current (uA) 4
Maximum Propagation Delay Time @ Maximum CL (ns) 8@5V
Propagation Delay Test Condition (pF) 50
Absolute Propagation Delay Time (ns) 12


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 20
Lead Shape Gull-wing
PCB 20
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 13(Max)
Package Width (mm) 7.6(Max)
Package Height (mm) 2.35(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 13(Max)
Package Overall Width (mm) 10.63(Max)
Package Overall Height (mm) 2.65(Max)
Seated Plane Height (mm) 2.65(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-013AC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Reel Width (mm) 24.4
Tape Pitch (mm) 12
Tape Width (mm) 24
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Pro Audio
• Video and Signage
• Appliances
• Factory Automation and Control
Продукт RFQ