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• Operating range 2 V to 5.5 V
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• Max tpd of 6.5 ns at 5 V
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• Low power consumption, 10-μA max ICC
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• ±8-mA output drive at 5 V
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• Schmitt-trigger action at all inputs makes the circuit tolerant for slower input rise and fall time
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• Latch-up performance exceeds 250 mA per JESD 17
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| CATALOG |
SN74AHC1G04DBVR COUNTRY OF ORIGIN
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SN74AHC1G04DBVR PARAMETRIC INFO
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SN74AHC1G04DBVR PACKAGE INFO
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SN74AHC1G04DBVR MANUFACTURING INFO
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SN74AHC1G04DBVR PACKAGING INFO
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SN74AHC1G04DBVR ECAD MODELS
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SN74AHC1G04DBVR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Thailand
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Malaysia
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Philippines
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|
PARAMETRIC INFO
|
| Logic Family |
AHC |
| Process Technology |
CMOS |
| Logic Function |
Inverter Schmitt Trigger |
| Input Type |
Schmitt Trigger |
| Output Type |
Push-Pull |
| Number of Elements per Chip |
1 |
| Minimum High Level Output Voltage (V) |
1.9 |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Low Level Output Voltage (V) |
0.36 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Commercial |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
10.6@3.3V|7.5@5V |
| Absolute Propagation Delay Time (ns) |
13 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-8 |
| Maximum Low Level Output Current (mA) |
8 |
| Maximum Quiescent Current (uA) |
1 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3(Max) |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9|9.2 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Cameras
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• E-Meters
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• Ethernet Switches
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• Infotainment
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