|
|
• Control inputs VIH/VIL levels are referenced to VCCA voltage
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• Fully configurable dual-rail design allows each port to operate over the full 1.2V to 3.6V power-supply range
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• I/Os Are 4.6V tolerant
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• Ioff supports partial power-down-mode operation
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• Maximum data rates:– 380Mbps (1.8V to 3.3V translation)– 200Mbps (< 1.8V to 3.3V translation)– 200Mbps (translate to 2.5V or 1.8V)– 150Mbps (translate to 1.5V)– 100Mbps (translate to 1.2V)
|
• Latch-up performance exceeds 100mA per JESD 78, Class II
|
• ESD protection exceeds JESD 22:– 8000V Human-Body Model (A114-A)– 150V Machine Model (A115-A)– 1000V Charged-Device Model (C101)
|
|
| CATALOG |
SN74AVC4T245PWR COUNTRY OF ORIGIN
|
SN74AVC4T245PWR PARAMETRIC INFO
|
SN74AVC4T245PWR PACKAGE INFO
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SN74AVC4T245PWR MANUFACTURING INFO
|
SN74AVC4T245PWR PACKAGING INFO
|
SN74AVC4T245PWR ECAD MODELS
|
SN74AVC4T245PWR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Taiwan (Province of China)
|
Malaysia
|
|
PARAMETRIC INFO
|
| Number of Channels |
4 |
| Channel Type |
Bidirectional |
| Logic Family |
AVC |
| Process Technology |
CMOS |
| Logic Function |
Voltage Level Translator |
| Output Type |
3-State |
| Minimum High Level Input Voltage (V) |
1.6 |
| Minimum Latch-Up Current (mA) |
100 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Commercial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
1.2 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum High Level Output Current (mA) |
-12 |
| Maximum Low Level Output Current (mA) |
12 |
| Maximum Quiescent Current (mA) |
0.016 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
6.3@1.4V to 1.6V |
| Absolute Propagation Delay Time (ns) |
10.3 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Personal electronics |
| • Industrial |
| • Enterprise |
| • Telecom |
| |
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