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• Up and down translation across 0.65 V to 3.6 V
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• Operating temperature: –40°C to +125°C
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• Designed with glitch suppression circuitry to improve power sequencing performance
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• Maximum quiescent current (ICCA + ICCB) of 10µA (85°C maximum) and 16µA (125°C maximum)
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• Up to 500Mbps support when translating from 1.8 to 3.3V
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• Ioff supports partial-power-down mode operation
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• Latch-up performance exceeds 100mA per JESD 78, Class II
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• ESD protection exceeds JESD 22:– 8000-V human body model– 1000-V charged-device model
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| CATALOG |
SN74AXC1T45DEAR COUNTRY OF ORIGIN
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SN74AXC1T45DEAR PARAMETRIC INFO
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SN74AXC1T45DEAR PACKAGE INFO
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SN74AXC1T45DEAR MANUFACTURING INFO
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SN74AXC1T45DEAR PACKAGING INFO
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SN74AXC1T45DEAR ECAD MODELS
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SN74AXC1T45DEAR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
Thailand
|
Philippines
|
|
PARAMETRIC INFO
|
| Number of Channels |
1 |
| Channel Type |
Bidirectional |
| Logic Family |
AXC |
| Logic Function |
Voltage Level Translator |
| Output Type |
3-State|Push-Pull |
| Minimum High Level Input Voltage (V) |
1.6 |
| Translation |
CMOS to CMOS |
| Minimum Latch-Up Current (mA) |
100 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Commercial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
0.65 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum High Level Output Current (mA) |
-12 |
| Maximum Low Level Output Current (mA) |
12 |
| Maximum Quiescent Current (mA) |
0.016 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
173@0.7V |
| Maximum Supply Current (mA) |
0.012 |
| Absolute Propagation Delay Time (ns) |
406 |
|
|
PACKAGE INFO
|
| Supplier Package |
X2SON |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
No Lead |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.35 |
| Package Length (mm) |
1.05(Max) |
| Package Width (mm) |
1.05(Max) |
| Package Height (mm) |
0.36(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
1.05(Max) |
| Package Overall Width (mm) |
1.05(Max) |
| Package Overall Height (mm) |
0.4(Max) |
| Seated Plane Height (mm) |
0.4(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.2(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline No Lead Package |
| Package Family Name |
SON |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Enterprise and communications |
| • Industrial |
| • Personal electronics |
| |
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