SN74HC244PWR Texas Instruments Octal Buffers and Line Drivers With 3-State Outputs

Logic Family	HC
Logic Function	Buffer/Line Driver
Input Signal Type	Single-Ended
Output Type	3-State
Polarity	Non-Inverting
Bus Hold	No
Number of Elements per Chip	2
Number of Channels per Chip	8
Number of Output Enables per Chip	2 Low
Number of Input Enables per Chip	0
Number of Inputs per Chip	8
Number of Outputs per Chip	8
Minimum Operating Supply Voltage (V)	2
Maximum Operating Supply Voltage (V)	6
Typical Operating Supply Voltage (V)	5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Maximum Propagation Delay Time @ Maximum CL (ns)	165@2V\|33@4.5V\|28@6V
Absolute Propagation Delay Time (ns)	250
Propagation Delay Test Condition (pF)	150
Maximum High Level Output Current (mA)	-7.8
Maximum Low Level Output Current (mA)	7.8
Maximum Quiescent Current (uA)	8

Supplier Package	TSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	20
Lead Shape	Gull-wing
PCB	20
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	6.6(Max)
Package Width (mm)	4.5(Max)
Package Height (mm)	1.05(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	6.6(Max)
Package Overall Width (mm)	6.6(Max)
Package Overall Height (mm)	1.2(Max)
Seated Plane Height (mm)	1.2(Max)
Mounting	Surface Mount
Terminal Width (mm)	0.3(Max)
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-153AC
Package Outline	Link to Datasheet

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

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