SN74LV1T126DBVR Texas Instruments IC BUF NON-INVERT 5.5V SOT23-5

label:
2025/05/21 16
SN74LV1T126DBVR Texas Instruments  IC BUF NON-INVERT 5.5V SOT23-5


• Single-supply voltage translator at 5V, 3.3V, 2.5V,and 1.8V VCC
• Operating range of 1.8V to 5.5V
• Logic output is referenced to VCC
• Characterized up to 50MHz at 3.3V VCC
• 5V tolerance on input pins
• –40°C to 125°C operating temperature range
• Latch-up performance exceeds 250mA per JESD 17


CATALOG
SN74LV1T126DBVR COUNTRY OF ORIGIN
SN74LV1T126DBVR PARAMETRIC INFO
SN74LV1T126DBVR PACKAGE INFO
SN74LV1T126DBVR MANUFACTURING INFO
SN74LV1T126DBVR PACKAGING INFO
SN74LV1T126DBVR ECAD MODELS
SN74LV1T126DBVR APPLICATIONS


COUNTRY OF ORIGIN
China
Malaysia
Philippines


PARAMETRIC INFO
Process Technology CMOS
Logic Family LV
Logic Function Schmitt Trigger Buffer/Line Driver
Input Signal Type Single-Ended
Output Type 3-State
Polarity Non-Inverting
Tolerant I/Os (V) 5 Inputs
Bus Hold No
Number of Elements per Chip 1
Maximum Supply Current (mA) 0.0055
Number of Channels per Chip 1
Number of Output Enables per Chip 1 High
Number of Input Enables per Chip 0
Number of Inputs per Chip 1
Number of Outputs per Chip 1
Minimum Operating Supply Voltage (V) 1.6
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 1.8|2.5|3.3|5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Commercial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Maximum Propagation Delay Time @ Maximum CL (ns) 14.5@1.8V|9.5@2.5V|8@3.3V|6.5@5V
Absolute Propagation Delay Time (ns) 16
Propagation Delay Test Condition (pF) 30
Maximum High Level Output Current (mA) -8
Maximum Low Level Output Current (mA) 8
Maximum Quiescent Current (uA) 1


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 4
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn|Au
Under Plating Material N/A|Pd over Ni
Terminal Base Material N/A|Cu Alloy
Number of Wave Cycles N/A


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Packaging Document Link to Datasheet

ECAD MODELS


APPLICATIONS
• Telecom
• Portable applications
• Servers
• PC and notebooks
Продукт RFQ