|
|
• VCC operation of 2 V to 5.5 V
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• Maximum tpd of 6.5 ns at 5 V
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• Typical VOLP (output ground bounce)<0.8 V at VCC = 3.3 V, TA = 25°C
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• Typical VOHV (output VOH undershoot)>2.3 V at VCC = 3.3 V, TA = 25°C
|
• Support mixed-mode voltage operation on all ports
|
• Ioff supports partial-power-down mode operation
|
• Latch-up performance exceeds 250-mA per JESD 17
|
|
| CATALOG |
SN74LV244APWR COUNTRY OF ORIGIN
|
SN74LV244APWR PARAMETRIC INFO
|
SN74LV244APWR PACKAGE INFO
|
SN74LV244APWR MANUFACTURING INFO
|
SN74LV244APWR PACKAGING INFO
|
SN74LV244APWR ECAD MODELS
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SN74LV244APWR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
Philippines
|
|
PARAMETRIC INFO
|
| Process Technology |
130nm |
| Logic Family |
LV |
| Logic Function |
Buffer/Line Driver |
| Input Signal Type |
Single-Ended |
| Output Type |
3-State |
| Polarity |
Non-Inverting |
| Tolerant I/Os (V) |
5 Inputs |
| Bus Hold |
No |
| Number of Elements per Chip |
2 |
| Number of Channels per Chip |
8 |
| Number of Output Enables per Chip |
2 Low |
| Number of Input Enables per Chip |
0 |
| Number of Inputs per Chip |
8 |
| Number of Outputs per Chip |
8 |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
15.3@2.5V|11.9@3.3V|7.5@5V |
| Absolute Propagation Delay Time (ns) |
21 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-16 |
| Maximum Low Level Output Current (mA) |
16 |
| Maximum Quiescent Current (uA) |
20 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
Gull-wing |
| PCB |
20 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.6(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.6(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Servers and network switches |
| • LED displays |
| • Telecom infrastructure |
| • Motor-drive control boards |
| |
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