|
|
• Single-Supply Voltage Translator at
5.0-V, 3.3-V, 2.5-V, and 1.8-V VCC
|
• Operating Range of 1.8 V to 5.5 V
|
• Up Translation
– 1.2 V(1) to 1.8 V at 1.8-V VCC
– 1.5 V(1) to 2.5 V at 2.5-V VCC
– 1.8 V(1) to 3.3 V at 3.3-V VCC
– 3.3 V to 5.0 V at 5.0-V VCC
|
| • Down Translation
– 3.3 V to 1.8 V at 1.8-V VCC
– 3.3 V to 2.5 V at 2.5-V VCC
– 5.0 V to 3.3 V at 3.3-V VCC |
| • Logic Output is Referenced to VCC |
| • Characterized up to 50 MHz at 3.3-V VCC |
| • 5.5 V Tolerance on Input Pins |
| • –40°C to 125°C Operating Temperature Range |
| • Pb-Free Packages Available: SC-70 (RGY)
– 3.5 × 3.5 × 1 mm
|
| • Latch-Up Performance Exceeds 250 mA Per
JESD 17 |
| • Supports Standard Logic Pinouts |
|
| CATALOG |
| SN74LV4T125RGYR COUNTRY OF ORIGIN |
SN74LV4T125RGYR PARAMETRIC INFO
|
SN74LV4T125RGYR PACKAGE INFO
|
SN74LV4T125RGYR MANUFACTURING INFO
|
SN74LV4T125RGYR PACKAGING INFO
|
SN74LV4T125RGYR ECAD MODELS
|
SN74LV4T125RGYR APPLICATIONS
|
|
| COUNTRY OF ORIGIN |
| Mexico |
| Malaysia |
| China |
|
PARAMETRIC INFO
|
| Number of Channels |
4 |
| Channel Type |
Unidirectional |
| Logic Family |
LV |
| Process Technology |
CMOS |
| Logic Function |
Voltage Level Shifter |
| Output Type |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Supply Voltage (V) |
1.6 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Maximum High Level Output Current (mA) |
-16 |
| Maximum Low Level Output Current (mA) |
16 |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
No Lead |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.65(Max) |
| Package Width (mm) |
3.65(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.65(Max) |
| Package Overall Width (mm) |
3.65(Max) |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-241-BA |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Tablet
|
• Smartphone
|
| • Personal Computer |
| • Industrial Automotive |
|
| |
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