 |
|
| • Operate From 1.65 V to 3.6 V |
| • Inputs Accept Voltages to 5.5 V |
| • Max tpd of 5.8 ns at 3.3 V |
| • Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C |
| • Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C |
| • Latch-Up Performance Exceeds 250 mA Per
JESD 17
|
|
| CATALOG |
| SN74LVC138ADR COUNTRY OF ORIGIN |
| SN74LVC138ADR PARAMETRIC INFO |
| SN74LVC138ADR PACKAGE INFO |
| SN74LVC138ADR MANUFACTURING INFO |
| SN74LVC138ADR PACKAGING INFO |
| SN74LVC138ADR ECAD MODELS |
| SN74LVC138ADR FUNCTIONAL BLOCK DIAGRAM |
| SN74LVC138ADR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Mexico |
| China |
|
| PARAMETRIC INFO |
| Logic Family |
LVC |
| Logic Function |
Decoder/Demultiplexer |
| Process Technology |
CMOS |
| Demultiplexing Capability |
1-of-8 |
| Number of Elements per Chip |
1 |
| Number of Element Inputs |
3 |
| Number of Element Outputs |
8 |
| Polarity |
Inverting |
| Maximum High Level Output Current (mA) |
-24 |
| Maximum Low Level Output Current (mA) |
24 |
| Number of Input Enables per Element |
3 |
| Number of Output Enables per Element |
0 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
7.9@2.7V|6.7@3.3V |
| Propagation Delay Test Condition (pF) |
50 |
| Absolute Propagation Delay Time (ns) |
22 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Quiescent Current (mA) |
0.01 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AC |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • LED Displays |
| • Servers |
| • White Goods |
| • Power Infrastructure |
| • Building Automation |
| • Factory Automation
|
| |
| |
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