SN74LVC1G0832DBVR Texas Instruments Single 3-Input Positive AND-OR Gate

label:
2025/08/12 12
SN74LVC1G0832DBVR Texas Instruments Single 3-Input Positive AND-OR Gate


CATALOG
SN74LVC1G0832DBVR COUNTRY OF ORIGIN
SN74LVC1G0832DBVR PARAMETRIC INFO
SN74LVC1G0832DBVR PACKAGE INFO
SN74LVC1G0832DBVR MANUFACTURING INFO
SN74LVC1G0832DBVR PACKAGING INFO
SN74LVC1G0832DBVR ECAD MODELS


COUNTRY OF ORIGIN
Philippines
China
Thailand


PARAMETRIC INFO
Logic Family LVC
Logic Function AND-OR
Number of Element Inputs 3-IN
Number of Element Outputs 1
Number of Elements per Chip 1
Number of Output Enables per Element 0
Number of Selection Inputs per Element 0
Output Type Push-Pull
Minimum Operating Supply Voltage (V) 1.65
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 1.8|2.5|3.3|5
Maximum High Level Output Current (mA) -32
Maximum Low Level Output Current (mA) 32
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Commercial
Maximum Propagation Delay Time @ Maximum CL (ns) 5.9@3.3V|4@5V
Absolute Propagation Delay Time (ns) 17.5
Propagation Delay Test Condition (pF) 50
Maximum Quiescent Current (uA) 10


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Gull-wing
PCB 6
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Terminal Width (mm) 0.5(Max)
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1.3
Minimum PACKAGE_DIMENSION_H 0.9
Maximum PACKAGE_DIMENSION_L 3.05
Minimum PACKAGE_DIMENSION_L 2.75
Maximum PACKAGE_DIMENSION_W 1.75
Minimum PACKAGE_DIMENSION_W 1.45
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.45
Minimum Seated_Plane_Height 0.9


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix DBVR
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ