|
| |
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
|
• ESD Protection Exceeds JESD 22– 2000-V Human-Body Model (A114-A)– 200-V Machine Model (A115-A)– 1000-V Charged-Device Model (C101)
|
• Available in the Texas Instruments NanoFree™
Package
|
| • Supports 5-V VCC Operation |
| • Inputs Accept Voltages to 5.5 V |
| • Max tpd of 4.6 ns at 3.3 V |
| |
| CATALOG |
| SN74LVC1G14DBVR COUNTRY OF ORIGIN |
SN74LVC1G14DBVR PARAMETRIC INFO
|
SN74LVC1G14DBVR PACKAGE INFO
|
SN74LVC1G14DBVR MANUFACTURING INFO
|
SN74LVC1G14DBVR PACKAGING INFO
|
SN74LVC1G14DBVR EACD MODELS
|
| SN74LVC1G14DBVR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Philippines |
| Thailand |
|
PARAMETRIC INFO
|
| Logic Family |
LVC |
| Process Technology |
CMOS |
| Logic Function |
Inverter Schmitt Trigger |
| Input Type |
Schmitt Trigger |
| Output Type |
Push-Pull |
| Number of Elements per Chip |
1 |
| Minimum High Level Output Voltage (V) |
1.2 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Low Level Output Voltage (V) |
0.7 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Commercial |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
6.5@3.3V|6@5V |
| Absolute Propagation Delay Time (ns) |
13 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-32 |
| Maximum Low Level Output Current (mA) |
32 |
| Maximum Quiescent Current (uA) |
10 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3(Max) |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
N/A|Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9|9.2 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • AV Receiver |
| • Audio Dock: Portable |
| • Blu-ray Player and Home Theater |
| • Embedded PC |
| • MP3 Player/Recorder (Portable Audio) |
| • Personal Digital Assistant (PDA) |
| • Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital |
| • Solid State Drive (SSD): Client and Enterprise |
|
• TV: LCD/Digital and High-Definition (HDTV)
|
| • Tablet: Enterprise |
| • Video Analytics: Server |
| • Wireless Headset, Keyboard, and Mouse |
| |
One-stop supplier of IC products