|
|
• Inputs Accept Voltages to 5.5 V
|
• Supports Down Translation to VCC
|
• Max tpd of 4.3 ns at 3.3 V
|
• Low Power Consumption, 10-µA Max ICC
|
• ±24-mA Output Drive at 3.3 V
|
|
| CATALOG |
SN74LVC1G175DCKR COUNTRY OF ORIGIN
|
SN74LVC1G175DCKR PACKAGE INFO
|
SN74LVC1G175DCKR MANUFACTURING INFO
|
SN74LVC1G175DCKR PACKAGING INFO
|
SN74LVC1G175DCKR ECAD MODELS
|
SN74LVC1G175DCKR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Thailand
|
|
PACKAGE INFO
|
| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.15(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.15(Max) |
| Package Overall Width (mm) |
2.4(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-203AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy|N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9|9.2 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
|
|
| APPLICATIONS |
• TV/Set Top Box/Audio
|
• EPOS (Electronic Point-of-Sale)
|
• Motor Drives
|
• PC/Notebook
|
• Servers
|
• Factory Automation and Control
|
• Tablets
|
| • Medical Healthcare and Fitness |
| • Smart Grid |
| • Telecom Infrastructure |
| • Enterprise Switching |
| • Projectors |
| • Storage |
| |
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