|
|
• Supports 5-V VCC Operation
|
• Inputs Accept Voltages to 5.5 V
|
• Low Power Consumption, 10-μA Max ICC
|
• ±24-mA Output Drive at 3.3 V
|
• Ioff Supports Partial-Power-Down Mode Operation
|
|
| CATALOG |
SN74LVC2G04DBVR COUNTRY OF ORIGIN
|
SN74LVC2G04DBVR PARAMETRIC INFO
|
SN74LVC2G04DBVR PACKAGE INFO
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SN74LVC2G04DBVR MANUFACTURING INFO
|
SN74LVC2G04DBVR PACKAGING INFO
|
SN74LVC2G04DBVR ECAD MODELS
|
SN74LVC2G04DBVR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Philippines
|
Thailand
|
Malaysia
|
|
PARAMETRIC INFO
|
| Logic Family |
LVC |
| Logic Function |
Inverter |
| Output Type |
Push-Pull |
| Maximum Supply Current (mA) |
0.01 |
| Number of Elements per Chip |
2 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Minimum High Level Output Voltage (V) |
1.2 |
| Maximum Low Level Output Voltage (V) |
0.55 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Commercial |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
4.6@3.3V|3.7@5V |
| Absolute Propagation Delay Time (ns) |
8 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-32 |
| Maximum Low Level Output Current (mA) |
32 |
| Maximum Quiescent Current (uA) |
10 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1.18 |
| Seated Plane Height (mm) |
1.18 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.38 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1.3 |
| Minimum PACKAGE_DIMENSION_H |
0.9 |
| Maximum PACKAGE_DIMENSION_L |
3.05 |
| Minimum PACKAGE_DIMENSION_L |
2.75 |
| Maximum PACKAGE_DIMENSION_W |
1.75 |
| Minimum PACKAGE_DIMENSION_W |
1.45 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.45 |
| Minimum Seated_Plane_Height |
0.9 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.08 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.45 |
| Terminal Thickness (mm) |
0.15 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
N/A|Cu Alloy |
| Number of Wave Cycles |
N/A |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • IP Phones: Wired and Wireless |
| • Optical Modules |
| • Optical Networking: EPON and Video Over Fiber |
| • Point-to-Point Microwave Backhaul |
| • Power: Telecom DC/DC Module: Analog and Digital |
| • Private Branch Exchanges (PBX) |
| • TETRA Base Exchanges |
| • Telecom Base Band Units |
| • Telecom Shelters: Power Distribution Units (PDU),Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET),Remote Radio Units (RRU), Tower Mounted |
| |
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