SN74LVC2G04DBVR Texas Instruments Dual Inverter Gate

Logic Family	LVC
Logic Function	Inverter
Output Type	Push-Pull
Maximum Supply Current (mA)	0.01
Number of Elements per Chip	2
Minimum Operating Supply Voltage (V)	1.65
Minimum High Level Output Voltage (V)	1.2
Maximum Low Level Output Voltage (V)	0.55
Maximum Operating Supply Voltage (V)	5.5
Typical Operating Supply Voltage (V)	1.8\|2.5\|3.3\|5
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Supplier Temperature Grade	Commercial
Maximum Propagation Delay Time @ Maximum CL (ns)	4.6@3.3V\|3.7@5V
Absolute Propagation Delay Time (ns)	8
Propagation Delay Test Condition (pF)	50
Maximum High Level Output Current (mA)	-32
Maximum Low Level Output Current (mA)	32
Maximum Quiescent Current (uA)	10

PACKAGE INFO

Supplier Package	SOT-23
Basic Package Type	Lead-Frame SMT
Pin Count	6
Lead Shape	Gull-wing
PCB	6
Tab	N/R
Pin Pitch (mm)	0.95
Package Length (mm)	2.9
Package Width (mm)	1.6
Package Height (mm)	1.1
Package Diameter (mm)	N/R
Package Overall Length (mm)	2.9
Package Overall Width (mm)	2.8
Package Overall Height (mm)	1.18
Seated Plane Height (mm)	1.18
Mounting	Surface Mount
Terminal Width (mm)	0.38
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Small Outline Transistor
Package Family Name	SOT
Jedec	MO-178
Package Outline	Link to Datasheet
Maximum PACKAGE_DIMENSION_H	1.3
Minimum PACKAGE_DIMENSION_H	0.9
Maximum PACKAGE_DIMENSION_L	3.05
Minimum PACKAGE_DIMENSION_L	2.75
Maximum PACKAGE_DIMENSION_W	1.75
Minimum PACKAGE_DIMENSION_W	1.45
Maximum Diameter	N/R
Minimum Diameter	N/R
Maximum Seated_Plane_Height	1.45
Minimum Seated_Plane_Height	0.9
Ball Array Length (mm)	N/R
Ball Array Width (mm)	N/R
Stand-off Height (mm)	0.08
Number of Column Balls	N/R
Number of Row Balls	N/R
Terminal Length (mm)	0.45
Terminal Thickness (mm)	0.15
Bottom Pad Length (mm)	N/R
Bottom Pad Width (mm)	N/R
Bottom Pad Chamfer	N/R

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	260
Wave Solder Time (Sec)	4
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Matte Sn\|Au
Under Plating Material	N/A\|Pd over Ni
Terminal Base Material	N/A\|Cu Alloy
Number of Wave Cycles	N/A

PACKAGING INFO

Packaging Suffix	R
Packaging	Tape and Reel
Quantity Of Packaging	3000
Reel Diameter (in)	7.09
Reel Width (mm)	8.4
Tape Pitch (mm)	4
Tape Width (mm)	8
Component Orientation	Q3
Packaging Document	Link to Datasheet

ECAD MODELS

APPLICATIONS

• IP Phones: Wired and Wireless

• Optical Modules

• Optical Networking: EPON and Video Over Fiber

• Point-to-Point Microwave Backhaul

• Power: Telecom DC/DC Module: Analog and Digital

• Private Branch Exchanges (PBX)

• TETRA Base Exchanges

• Telecom Base Band Units

• Telecom Shelters: Power Distribution Units (PDU),Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET),Remote Radio Units (RRU), Tower Mounted