|
|
• Schmitt-Trigger inputs provide hysteresis
|
• Supports 5-V VCC Operation
|
• Inputs Accept Voltages to 5.5 V
|
• Low Power Consumption, 10-μA Max ICC
|
• ±24-mA Output Drive at 3.3 V
|
|
| CATALOG |
SN74LVC2G17DCKR COUNTRY OF ORIGIN
|
SN74LVC2G17DCKR PARAMETRIC INFO
|
SN74LVC2G17DCKR PACKAGE INFO
|
SN74LVC2G17DCKR MANUFACTURING INFO
|
SN74LVC2G17DCKR PACKAGING INFO
|
SN74LVC2G17DCKR ECAD MODELS
|
SN74LVC2G17DCKR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Thailand
|
Malaysia
|
|
PARAMETRIC INFO
|
| Process Technology |
CMOS |
| Logic Family |
LVC |
| Logic Function |
Schmitt Trigger Buffer |
| Input Signal Type |
Single-Ended |
| Output Type |
Push-Pull |
| Polarity |
Non-Inverting |
| Tolerant I/Os (V) |
5 |
| Bus Hold |
No |
| Number of Elements per Chip |
2 |
| Number of Channels per Chip |
2 |
| Number of Output Enables per Chip |
0 |
| Number of Input Enables per Chip |
0 |
| Number of Inputs per Chip |
2 |
| Number of Outputs per Chip |
2 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Commercial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
5.9@3.3V|4.8@5V |
| Absolute Propagation Delay Time (ns) |
9.8 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-32 |
| Maximum Low Level Output Current (mA) |
32 |
| Maximum Quiescent Current (uA) |
10 |
|
|
PACKAGE INFO
|
| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.15(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.15(Max) |
| Package Overall Width (mm) |
2.4(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-203AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
N/A|Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9|9.2 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
 |
|
| APPLICATIONS |
| • AV Receivers |
| • Audio Docks: Portable |
| • Blu-ray Players and Home Theater |
| • MP3 Players/Recorders |
| • Personal Digital Assistants (PDAs) |
| • Solid State Drives (SSDs): Client and Enterprise |
| |
One-stop supplier of IC products