|
|
• Control inputs VIH/VIL levels are referenced to
VCCA voltage
|
• VCC isolation feature – if either VCC input is at
GND, all are in the high-impedance state
|
• Fully configurable dual-rail design allows each port
to operate over the full 1.65-V to 5.5-V powersupply range
|
| • Latch-up performance exceeds 100 mA per JESD
78, class II |
| • ESD protection exceeds JESD 22
– 4000-V Human-Body Model (A114-A)
– 100-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101) |
|
| CATALOG |
| SN74LVC8T245RHLR COUNTRY OF ORIGIN |
SN74LVC8T245RHLR PARAMETRIC INFO
|
SN74LVC8T245RHLR PACKAGE INFO
|
SN74LVC8T245RHLR MANUFACTURING INFO
|
SN74LVC8T245RHLR PACKAGING INFO
|
SN74LVC8T245RHLR ECAD MODELS
|
SN74LVC8T245RHLR APPLICATIONS
|
|
| COUNTRY OF ORIGIN |
| Malaysia |
| China |
|
PARAMETRIC INFO
|
| Number of Channels |
8 |
| Channel Type |
Bidirectional |
| Logic Family |
LVC |
| Process Technology |
CMOS |
| Logic Function |
Voltage Level Translator |
| Output Type |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Commercial |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Maximum High Level Output Current (mA) |
-32 |
| Maximum Low Level Output Current (mA) |
32 |
| Maximum Quiescent Current (mA) |
0.015 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
23.8@1.8V |
| Absolute Propagation Delay Time (ns) |
32.2 |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5.6(Max) |
| Package Width (mm) |
3.6(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.6(Max) |
| Package Overall Width (mm) |
3.6(Max) |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-241 |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Personal electronic
|
• Industrial
|
| • Enterprise
|
| • Telecom
|
|
| |
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