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• Bidirectional voltage translator
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• 2.3 V to 3.6 V on A port and 3 V to 5.5 V on B port
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• Control inputs VIH and VIL levels are referenced to VCCA voltage
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• Latch-up performance exceeds 250 mA per JESD 17
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• ESD protection exceeds JESD 22– 2000-V Human Body Model (A114-A)– 1000-V Charged-Device Model (C101) |
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CATALOG |
SN74LVCC3245ADBR COUNTRY OF ORIGIN |
SN74LVCC3245ADBR PARAMETRIC INFO
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SN74LVCC3245ADBR PACKAGE INFO
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SN74LVCC3245ADBR MANUFACTURING INFO
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SN74LVCC3245ADBR PACKAGING INFO
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SN74LVCC3245ADBR EACD MODELS
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SN74LVCC3245ADBR APPLICATIONS |
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COUNTRY OF ORIGIN |
Malaysia |
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PARAMETRIC INFO
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Number of Channels |
8 |
Channel Type |
Bidirectional |
Logic Family |
LVC |
Process Technology |
CMOS |
Logic Function |
Voltage Level Translator |
Output Type |
3-State |
Minimum High Level Input Voltage (V) |
1.7 |
Minimum Latch-Up Current (mA) |
250 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Supply Voltage (V) |
2.3/3 |
Maximum Operating Supply Voltage (V) |
3.6/5.5 |
Typical Operating Supply Voltage (V) |
3.3/5 |
Maximum High Level Output Current (mA) |
-twenty four |
Maximum Low Level Output Current (mA) |
twenty four |
Maximum Quiescent Current (mA) |
0.08 |
Maximum Propagation Delay Time @ Maximum CL (ns) |
11.2@2.3V to 2.7V@3V to 3.6V |
Absolute Propagation Delay Time (ns) |
14.5 |
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PACKAGE INFO
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Supplier packaging |
SSOP |
Basic package type |
Lead-Frame SMT |
Number of pins |
twenty four |
Pin shape |
Gull-wing |
PCB |
twenty four |
ears |
N/R |
Pin spacing (mm) |
0.65 |
Package length (mm) |
8.5(Max) |
Package width (mm) |
5.6(Max) |
Package height (mm) |
2(Max)-0.05(Min) |
Package diameter (mm) |
N/R |
Package Overall Length (mm) |
8.5(Max) |
Package Overall Width (mm) |
8.2(Max) |
Package Overall Height (mm) |
2(Max) |
Mounting surface height (mm) |
2(Max) |
Install |
Surface Mount |
Package weight (g) |
not applicable |
Packaging materials |
Plastic |
package instruction |
Shrink Small Outline Package |
Package series name |
SO |
JEDEC |
MO-150 |
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MANUFACTURING INFO
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MSL |
1 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
30 |
Number of reflow cycles |
3 |
standard |
J-STD-020D |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
N/R |
Wave soldering time (seconds) |
N/R |
Lead Finish(Plating) |
Au |
Plating materials |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging Suffix |
R |
Package |
Tape and reel packaging |
Packing quantity |
2000 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
16.4 |
Tape Pitch (mm) |
12 |
Tape Width (mm) |
16 |
Component Orientation |
Q1 |
packaging type file |
Link to datasheet |
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ECAD MODELS
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APPLICATIONS
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• Level translation
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• USB |
• Interfacing |
• Analog and digital applications |
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