SN74LVCC3245ADBR Texas Instruments SN74LVCC3245A Octal Bus Transceiver With Adjustable Output Voltage and 3-State Outputs

label:
2024/03/7 196



• Bidirectional voltage translator
• 2.3 V to 3.6 V on A port and 3 V to 5.5 V on B port
• Control inputs VIH and VIL levels are referenced to VCCA voltage
• Latch-up performance exceeds 250 mA per JESD 17
• ESD protection exceeds JESD 22– 2000-V Human Body Model (A114-A)– 1000-V Charged-Device Model (C101)


CATALOG
SN74LVCC3245ADBR COUNTRY OF ORIGIN
SN74LVCC3245ADBR PARAMETRIC INFO
SN74LVCC3245ADBR PACKAGE INFO
SN74LVCC3245ADBR MANUFACTURING INFO
SN74LVCC3245ADBR PACKAGING INFO
SN74LVCC3245ADBR EACD MODELS
SN74LVCC3245ADBR APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Number of Channels 8
Channel Type Bidirectional
Logic Family LVC
Process Technology CMOS
Logic Function Voltage Level Translator
Output Type 3-State
Minimum High Level Input Voltage (V) 1.7
Minimum Latch-Up Current (mA) 250
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Minimum Operating Supply Voltage (V) 2.3/3
Maximum Operating Supply Voltage (V) 3.6/5.5
Typical Operating Supply Voltage (V) 3.3/5
Maximum High Level Output Current (mA) -twenty four
Maximum Low Level Output Current (mA) twenty four
Maximum Quiescent Current (mA) 0.08
Maximum Propagation Delay Time @ Maximum CL (ns) 11.2@2.3V to 2.7V@3V to 3.6V
Absolute Propagation Delay Time (ns) 14.5


PACKAGE INFO
Supplier packaging SSOP
Basic package type Lead-Frame SMT
Number of pins twenty four
Pin shape Gull-wing
PCB twenty four
ears N/R
Pin spacing (mm) 0.65
Package length (mm) 8.5(Max)
Package width (mm) 5.6(Max)
Package height (mm) 2(Max)-0.05(Min)
Package diameter (mm) N/R
Package Overall Length (mm) 8.5(Max)
Package Overall Width (mm) 8.2(Max)
Package Overall Height (mm) 2(Max)
Mounting surface height (mm) 2(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Shrink Small Outline Package
Package series name SO
JEDEC MO-150


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard J-STD-020D
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Au
Plating materials Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix R
Package Tape and reel packaging
Packing quantity 2000
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 12
Tape Width (mm) 16
Component Orientation Q1
packaging type file Link to datasheet


ECAD MODELS



APPLICATIONS
• Level translation
• USB
• Interfacing
• Analog and digital applications
Продукт RFQ