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• LVDS Display Series Interfaces Directly to LCD Display Panels With Integrated LVDS
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• Package Options: 4.5-mm x 7-mm BGA, and 8.1-mm x 14-mm TSSOP
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• 1.8-V Up to 3.3-V Tolerant Data Inputs to Connect Directly to Low-Power, Low-Voltage Application and Graphic Processors
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• Transfer Rate up to 135 Mpps (Mega Pixel Per Second); Pixel Clock Frequency Range 10 MHz to 135 MHz
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• Suited for Display Resolutions Ranging From HVGA up to HD With Low EMI
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• Operates From a Single 3.3-V Supply and 170.mW (Typ.) at 75 MHz
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• 28 Data Channels Plus Clock in Low-Voltage TTL to 4 Data Channels Plus Clock Out Low-Voltage Differential
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• Consumes Less Than 1 mW When Disabled
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• Selectable Rising or Falling Clock Edge Triggered Inputs
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| CATALOG |
| SN75LVDS83BDGGR COUNTRY OF ORIGIN |
SN75LVDS83BDGGR PARAMETRIC INFO
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SN75LVDS83BDGGR PACKAGE INFO
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SN75LVDS83BDGGR MANUFACTURING INFO
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SN75LVDS83BDGGR PACKAGING INFO
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SN75LVDS83BDGGR ECAD MODELS
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SN75LVDS83BDGGR APPLICATIONS
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COUNTRY OF ORIGIN
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| Malaysia |
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PARAMETRIC INFO
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| Function |
Transmitter |
| Number of Drivers |
5 |
| Number of Receivers |
0 |
| Input Signal Type |
LVCMOS |
| Number of Elements per Chip |
4 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Input Current (uA) |
25 |
| Output Signal Type |
LVDS |
| Maximum Differential Output Voltage (V) |
0.45 |
| Maximum Power Dissipation (mW) |
1730 |
| Minimum Operating Frequency (MHz) |
10 |
| Maximum Operating Frequency (MHz) |
135 |
| Minimum Operating Temperature (°C) |
-10 |
| Maximum Operating Temperature (°C) |
70 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
56 |
| Lead Shape |
Gull-wing |
| PCB |
56 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
14.1(Max) |
| Package Width (mm) |
6.2(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
14.1(Max) |
| Package Overall Width (mm) |
8.3(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-153 |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
24.4 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
24 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• LCD Display Panel Driver
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• UMPC and Netbook PC
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• Digital Picture Frame
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